- H2O2濃度管理系統
W Slurry , Cu Slurry等的酸化劑調和系統
濃度精度,目標濃度±0.1wt%
Features
• Correspondence to the various Slurry which diversify (Silica, Ceria, Aluminum base, etc)
• A lot of application experience to 300mm 65nm process
• Stabilization of Polishing process by periodical cleaning by an automatic cleaning system
• Adoption of materials and parts in consideration of Slurry properties of matter (tank, Pump, Valve, etc)
• Various patent technology for Slurry system (a mixture for mixing, concentration management, particle monitor, etc)